nokia诺基亚核基质蛋白表面贴装工艺规格(20页)-食品饮料(编辑修改稿)

nokia诺基亚核基质蛋白表面贴装工艺规格(20页)-食品饮料(编辑修改稿)内容摘要：

egardless of ball count, most optical devices based on acrylic plastics (IR modules, all LEDs), special plastic integrates structures (plastic power devices including polyimide tape or equivalent interfaces). The purpose of NMP baking is to decrease amount of water from plastic packages prior soldering. As absorbed water vaporise in reflow, internal cracks and failures may be created. Note standards and instructions for moisture sensitive ponents regarding protective packing in shipping and storage together with this specification. Page 6(20) CONFIDENTIAL MES00009 中管网通用业频道 企业 () NMP SMD Process Specification Copyright  Nokia Mobile Phones 中管网通用业频道 企业 () Moisture sensitive ponent unprotected exposure time in ambient Preventative action required More than 48, but less than 168 hours, In case JEDEC class 5a or 6, more than 24 h bake condition: 12 (+10,2)h @60 5C, RH 5% More than 168 hours bake condition: 168h@605C, RH 5% Note! Prevent direct contact of reels to drying chamber side and bottom walls, since these may be at significantly higher temperature than oven controller indicates. Verify feasibility of drying oven to ponent moisture removal and effect of various loading conditions by careful study of oven temperature control system. Page 7(20) CONFIDENTIAL MES00009 中管网通用业频道 企业 () NMP SMD Process Specification Copyright  Nokia Mobile Phones 中管网通用业频道 企业 () 2. PASTE SPECIFICATIONS Solder paste Multicore Solders NMP code 7600017 (650 g cartridge) 7600015 (500 g jar) Delivery package 650 g Semco cartridge 500 g jar Solder alloy Sn62Pb36Ag2 Particle size ABS (5325 um) Metal content % (+%, %) Flux activity classification (JSTD004) ROL1 Viscosity (Mal PCU205 @ 25176。 C):* TI  10% 10 rpm 1700 P  10% *) Note: Viscosity specification for reference only. Considerable differences can exist between individual measuring equipment. Thixotropic Index  )18(c o s )(c o slo g rp mityv is rp mityv isTI Page 8(20) CONFIDENTIAL MES00009 中管网通用业频道 企业 () NMP SMD Process Specification Copyright  Nokia Mobile Phones 中管网通用业频道 企业 () 3. STENCIL PRINTING PROCESS SPECIFICATIONS Squeegee Property Specification Squeegee blade material Corrosion protected spring steel, stainless steel or titanium coated with adequate stiffness for high speed printing Print angle* (critical parameter) 176。  176。 Squeegee width for DEKamp。 MPM and equivalent printers Panel length rounded up to closest std width Paste retainers Required, adjust close to stencil surface, but retainers must not touch stencil during printing operations if not spring loaded Remended squeegee types MPM: 8 or 12 MPM squeegee assembly DEK: 200 mm or 250 mm DEK squeegee assembly ICL Omni Print 8 or 12 squeegee assembly with spring loaded paste retainers Titano UP8, 8 titanium coated blades Note! Squeegee flexural strength is a critical parameter. *) Method of measurement: Bevel protractor Stencil Property Specification Stencil frame coplanarity measured at the bottom surface Max 1mm, remove possible adhesive residues Screen material Normal grade polyester screen 55T66T (140167 mesh/inch), equivalent stainless steel accepted, but not remended Screen tension (measurements on stencil foil will give erroneous, but indicative results) after stencil attachment at any point* min 25N/cm Stencil aperture opening dimensional variation max  10 m or  5% deviation maximum Stencil thickness (DCT4 products, 0201pad geometry, CSP pitch)  Page 9(20) CONFIDENTIAL MES00009 中管网通用业频道 企业 () NMP SMD Process Specification Copyright  Nokia Mobile Phones 中管网通用业频道 企业 () Stencil thickness (0402 or min pitch QFP, min pitch CSP)  Stencil material Electro formed nickel or laser cut stainless steel Remended stencil area of frame inner area 60%  10% Stencil rejection criteria by tension in production measured at screen at any point* 20N/cm or less Fiducials 2x1mm dia sphere etched halfway on stencil *) Method of measurement: Fabric Tension Gauge, for example ZBF Tetkomat, CH8803 R252。 schlikon, Switzerland, fax. 01/724 15 25, or equivalent. Support tables Property Specification Material Machined construction metal as steel or anodized Al alloy. High friction surface on the top remended. Support table parallelity to stencil frame clamps Max Supporting surface smoothness  on whole area Machining depth* Max ponent height + min 5 mm Module edge support* Module edge supported  from edge towards module center, max edge span around critical areas without support max 15mm Module inner area support (support pins)* Max PWB span without support 35mm Support pins* Machined in dedicated workholder, M3x15 set screws or equivalent Vacuum holes on support table Primarily locate at nonprintable area and prevent vacuum leakage to print area. If vacuum can be limited to 100200 mbar reliably, vacuum assistance over whole area may be possible with careful process adjustment. *) Side2 support table only Printing process parameters (stencil printing) Parameter Setting Print speed 100mm/s remended, min 70mm/s, max Page 10(20) CONFIDENTIAL MES00009 中管网通用业频道 企业 () NMP SMD Process Specification Copyright  Nokia Mobile Phones 中管网通用业频道 企业 () 120mm/s Note: Under nonconforming situations caused by technical problems, lower than specified speeds are temporarily accepted. Squeegee pressure for 200mm wide squeegee** in constant force mode (force automatically adjusted, print head floating) minimum pressure that will wipe stencil surface clean。