智能传感器的蓝牙技术与soc结构设计(编辑修改稿)

智能传感器的蓝牙技术与soc结构设计(编辑修改稿)内容摘要：

e a voice munication processing standard and the corresponding control mand. (4) choose agreement. Choose agreement and the user39。 s application related, including point to point agreement (PPP), the user datagram/transmission control protocol/Inter protocol (UDP and TCP/IP), target exchange protocol (OBEX), wireless application protocol (WAP), wireless application environment (WAE), vCard, vCal, infrared mobile munication (IrMC). Choose the specific contents of the protocol layer by application system choose according to need In addition to the above agreement layer outside, bluetooth protocol stack shall include two interface: one is the host controller interface (HCI), used for baseband controller, link controller and access hardware state and control regiter, provides the mand interface。 The other is a and baseband processing part directly connected audio interface to transfer audio data. In the bluetooth protocol stack, HCI above part usually use software to realize, including the logical link control and adaptive agreement L2CAP, serial simulation RFCOMM, link management protocol (LMP), telephone alternative agreement and choose agreement。 And HCI the following part use hardware implementation, including baseband agreement and link management protocol (LMP), this part also called bluetooth protocol system structure of bottom hardware modules. 2 bluetooth core protocol stack hardware circuit structure Bottom module is the core of the bluetooth module, mainly by radio frequency (RF) unit circuit, baseband layer (base band) circuit and Link management (LMP, Link Manger Protocol) circuit position. (1) radio frequency (RF) unit RF unit circuit for bluetooth technology provides the munication of the physical layer, also called bluetooth transceiver. Through the GHz microwave, realize data stream filter and transmission. Bluetooth protocol provides information about bluetooth transceiver various technique indexes. (2) baseband layer circuit Baseband layer provides base band digital signal processing hardware, its function is to provide link control, so also known as baseband and link control layer circuit. Through the baseband layer circuit, can build a bluetooth munication work in physical link, thus forming pico (pico). Baseband layer there are two physical link, one kind is connectionoriented synchronous link (SCO) partners, another kind is asynchronous connectionless link (ACL). In addition, baseband layer can also for voice and data packet to provide different levels of forward error correction (FEC) or circulating redundancy check (CRC) processing, and can be used for data encryption. At the same time, baseband circuit layer for different types of data (including transmit information data, link management and control information) to provide specific channel. (3) link management (LMP) circuit Link management circuit also called link manager circuit, the function is to provide link management protocol. Link management protocol used to link to set and control, and is responsible for establishing and cancellation of the bluetooth connection of equipment room, power control and the authentication and encryption, but also control bluetooth device working condition (keep hold, dormancy park, breathing sniff and activities active). The main functions of the link management by software, link manager circuit provide runs on bluetooth device processor of software. Link manager of munication between the agreement called the link management protocol (LMP). Bluetooth technology overall framework to HCI (Host Controller Interface) as a border, divided into hardware module, and the upper software agreement two parts. Bluetooth technology standard, the choice of the USB, UART or RS232 as hardware module and interface between the host. When the bluetooth module with USB, UART RS232 or any one of the interface and host connection, HCI interface upper munication protocol by host is responsible for processing, and the lower HCI interface munication protocol by the module of the baseband layer chip and RF chip is responsible for. According to the bluetooth standard, bluetooth system basic ponents including antenna, transceiver, baseband controller. Therefore, in the antenna, RF receive multiplier and baseband controller, under the support of bluetooth system position can be very flexible, can achieve a variety of different implementation scheme. Embedded bluetooth system is will RF and baseband part integrated on a single chip, single chip bluetooth hardware module structure. In the embedded bluetooth devices, hardware structure can be divided into link manager, link controller and RF module 3 parts, responsible for handling LMP layer, baseband layer and RF layer protocol. Link manager contains processing unit (CPU), memory, etc ponents. Link manager and baseband layer chip known collectively as link controller. RF module contains RF radio frequency emission ponents, and host connected interface is located in the link on the controller. In embedded scheme, bluetooth protocol upper software agreement also all curing in chip, chip through the USB or UART interface and application system connected. Because on chip embedded CPU, so, the embedded bluetooth system is actually a intelligent terminal, suitable for any device with CPU of the system. For example, intelligent sensor, want to add a singl。