麦x锡-weekassessmentsummary(编辑修改稿)

麦x锡-weekassessmentsummary(编辑修改稿)内容摘要：

e seconds per piece ** Observed Source: Cycle time studies。 McKinsey shop floor observations Load stretch Mold Trim and pin Cutting Tipping Trim Bond Bond 2 Inspect Distal Bond 3 Inspect Com ponent veri fication Apply tube Crimp Final inspect Coil product Seal tray Pack aging final SFP audit TT 177。 15% Subassembly ponent Subassembly (inner) Final assembly Assembly 2 Inner packaging No. of stations** Utilized/ available 2/5 2/10 2/10 1/3 1/3 1/1 4/8 4/8 2/4 2/4 2/4 2/4 2/4 2/4 2/4 2/4 3/3 3/3 3/3 3/3 ESTIMATE 29 25 21 31 27 23 78 68 58 20 17 15 11 2 3 . 61 5 . 51 2 . 77 . 81 0 . 32 1 . 88 . 82 9 . 11 1 . 51 8 . 21 6 . 19 . 72 1 . 81 6 . 12 9 . 11 1 . 88 . 28 . 89 . 71 7 . 61 0 . 51 0 . 5 8 . 49 . 81 0 . 51 2 . 79 . 71 7 . 96 . 55 . 93 . 33 . 26 . 47 . 83 . 94 . 22 1 . 02 1 . 01 . 95 . 25 . 65 . 9Walk to cure area and return Finish lot。 plete paperwork Tray set up Bond Backfill Leak test Load Component 100% = 55 90 43 100 51 VALUEADDED IMPROVEMENT POTENTIAL Percent。 seconds/piece NVA Percent * Possible causes • Handling/fixturing • Excessive paperwork/traceability • Nonrepeating process Possible opportunities • Improve quality/yield • Improve tracking method and/or remove unnecessary paperwork • Introduce and manage to standardized work instruction Place in foam, straighten Slide inner into outer Slip liner and set Walk and obtain tray, confirm new lot Walk and obtain tray, confirm new lot Place arm guards Obtain adhesive Bond area 4 Bond area 3 Move guards, adjust scope Check and re bond area 2 Check and re bond t Finish lot and plete paperwork Walk and obtain tray, confirm new lot Obtain adhesive Backfill area 3 Adjust scope Adjust scope Backfill area 2 Finish lot and plete paperwork Obtain parts and place in tray Place fixture Load 2 parts Check diameter Run tester Blowout parts Place caps, remove fixture Dry exterior Unload Open container Retrieve ponent Pick up part Remove sheath Load tool Load ponent Remove tool Inspect Place on tray Prepare/confirm new lot Finish lot, plete paperwork * Assumes process is not improved to eliminate rechecking and rebonding work elements Source: Observation of both 1st/2nd shifts 4/1927/99 Value added 12 Designed for flexibility, at expense of reliability Raw material consistency 5% destructive testing Start up new lot 34% Lack appropriate support to fix design problems Not making product frequently POTENTIAL CAUSES OF LOW YIELD Source: Discussion with Subassembly management team EXERCISE Problem: (yield) ~63% yield on ponent raw material (dropped 70 63%) 1 year Machine Material Method Human Mix/new product Differences of equipment Performance of towers vary Components designed for failure Water heater No specs on target levels of efficiency availability Machines not robust Downtime Capability is not established Leak, burst Material limits Breaking, stretching Elasticity Starbursts Body length (short/long) Clear spots Product pushing material limits Low bursts Oversized od/id Volumes, constantly changing Crosstraining to support fluctuation Production planning dedicated vs. nondedi cated equipment Visual inspection of material Multishifts Varying methods Accept pilot process with low yield because of schedules Operator reaction to fluctuation Inspection is subjective Oversized od/id Wrong mold Job rotation Crosstraining Repetitive motion Not involved as much as should be Incorrect documentation Operator not consistent in finding solutions New requirements Tighter specs on ponent Nick/Alan (scheduling) Startup process Select wrong mold Specs changing on material Activities which staff perce。